Eden ESP - VIA Eden ESP Embedded System Platform Processor

Eden ESP - VIA Eden ESP Embedded System Platform Processor Simple Type: Processor

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Part Number:: Eden ESP
Model Number:: Eden ESP
Make:: VIA
Lead Time:: Available
Qty In Stock:: Available

VIA Eden ESP Embedded System Platform Processor Simple Type: Processor

The VIA Eden Embedded System Platform Processor (VIA Eden ESP for short) is based upon a unique internal architecture and is manufactured using advanced 0.15µ / 0.13µ CMOS technology. The VIA Eden ESP architecture and companion chips provide a highly compatible, high-performance, low-cost, and low-power solution for the embedded, min-notebook, embedded, and Internet Appliance markets. The VIA Eden ESP is available in several operating frequencies. When considered individually, the compatibility, function, performance, cost, and power dissipation of the VIA Eden ESP family are all very competitive. Furthermore, the value added from the advanced EBGA packaging includes remarkable compactness, cost efficiency and excellent thermal characteristics. The VIA Eden ESP represents a breakthrough combination for enabling high-value, high-performance, low-power, fanless x86-based solutions. When considered as a whole, the VIA Eden ESP family offers a peerless level of value.

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Features

64-KB Level 2 victim cache
A proprietary Enhanced Ball Grid Array (EBGA) package that shares with Socket 370 processors features such as bus protocol and electrical interface
AMD-compatible 3DNow! Instructions (Model 7)
Branch Target Address Cache with 1k entries each identifying 2 branches (Model 9)
Bus speeds up to 133 MHz
Compact and economical EBGA packaging with excellent thermal dissipation characteristics
Extremely low power dissipation for fanless operation
MMX-compatible instructions for enhanced media performance
Seamlessly software compatible with the thousands of available x86 software applications
SSE-compatible instructions (Model 9)
Two large (64-KB each, 4-way) on-chip Level 1 caches (2-way in Model 9 Stepping 8 and higher)
Two large TLBs (128 entries each, 8-way) with two page directory caches
Unique and sophisticated branch prediction mechanisms
Very small die 52 mm2 in TSMC 0.13µ for Model 9 (47 mm2 for Stepping 8 and higher)
Very small die 52 mm2 in TSMC 0.15µ for Model 7

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